Your browser is out-of-date!

Update your browser to view this website correctly. Update my browser now


TI Sampling 0.47” FullHD Pico-Class DLP Chipset

DallasTexas Instruments (TI) said Wednesday that a 0.47-inch FullHD 1080p DLP chipset optimized for portable video and data projectors is now sampling to its third-party developer network.

The chipset is called TI’s smallest FullHD DLP chipset to date, enabling 1080p projection from compact applications, including mobile projectors (battery and AC-powered), screen-less TVs, control panels, interactive displays and wearables, such as near-eye displays like Google Glass or augmented reality viewers.

Key features of the 0.47-inch TRP display chipset include a FullHD resolution and low power consumption needed for use in battery-powered applications, such as pico projectors and wearable devices.

The chipset is said to be based on “proven DLP Cinema technology” and capable of generating brighter, more efficient FullHD projection displays from small-form-factor electronics.

The chipset uses TI’s proprietary DLP TRP architecture and adaptive DLP IntelliBright suite of algorithms to produce 100 percent higher brightness or up to 50 percent lower power consumption than previous DLP pico chipset architectures, the company said.

DLP TRP architecture delivers twice the resolution of its same-size predecessor, according to TI.

To accelerate developers’ ability to bring their innovative products to market, TI said it maintains the most extensive ecosystem of pico optical engine manufacturers in the industry, eliminating the need for developers to have their own optics expertise.  Members of TI’s third-party ecosystem are now developing optical engines that incorporate the 0.47-inch TRP FullHD 1080p chipset.

The chipset will be available in early 2015 for purchase from the TI store in evaluation quantities and from TI-authorized distributors in high-volume quantities, the company said.

It includes the DLP4710 digital micromirror device, which will be offered in a 100-pin FQL package. Other components in the chipset are the DLPC3439, which will be available in a 201-pin VFBGA package, and the DLPA3005 that will be offered in a 100-pin HTQFP package.