GE Appliances will source a larger share of the semiconductors used in its next generation of connected laundry appliances from Texas Instruments (TI), with production scheduled to begin in 2027 at the company’s new manufacturing facility in Louisville, Ky.
The company said TI microcontrollers, Wi-Fi connectivity solutions, and analog semiconductors will make up approximately one-third of the chips used in laundry products built at the plant. The expanded agreement nearly doubles GE Appliances’ spending with TI and supports the appliance maker’s broader effort to strengthen its U.S.-based supply chain.
For consumers, the partnership is expected to influence the technology inside future washers and dryers rather than the appliances’ outward design. GE Appliances plans to use TI components to support wireless connectivity, improve power management, enhance motor control, and enable more advanced software features.
“Expanding our work with Texas Instruments gives us access to a differentiated semiconductor portfolio backed by domestic manufacturing,” said Lee Lagomarcino, Vice President of Clothes Care for GE Appliances. “TI’s broad portfolio of advanced embedded processing and analog technology will help our engineers design appliances that are smarter, more powerful, and more efficient than ever before. Moving forward, our domestic research and development teams can also save significant time on new solutions for U.S. consumers.”
According to GE Appliances, the semiconductors will enable next-generation Wi-Fi connectivity with integrated Bluetooth Low Energy, allowing future laundry appliances to support more secure connected features. The company also plans to incorporate advanced power conversion technology designed to improve energy efficiency, system diagnostics, and overall appliance reliability.
Another focus is motor control. TI’s motor drive technology, including gallium nitride (GaN)-based drivers, is intended to improve drain pump operation, reduce operating noise, and increase overall system efficiency while reducing component size.
Looking ahead, GE Appliances is also evaluating TI’s latest intelligent microcontroller platform for future products. The technology could enable AI-assisted features such as predictive maintenance, adaptive wash performance, and centralized control of appliance functions.
The chips will be manufactured at TI facilities in Lehi, Utah, Richardson, Texas, and Sherman, Texas, supporting GE Appliances’ goal of increasing domestic sourcing for key components used in its U.S.-built products.
“We’re proud to support GE Appliances as they expand their U.S. manufacturing supply chain. By bringing together next-generation Wi-Fi connectivity, energy-efficient microcontrollers, edge AI capabilities, and breakthrough GaN-based motor drive technology, TI is giving GE Appliances the building blocks to design smarter, more efficient, and more connected appliances. And we are proud to have our U.S.-produced chips integrated into GE Appliance’s U.S.-produced appliances,” said Vinay Agarwal, Vice President and General Manager of MSP Microcontrollers, Texas Instruments.
