Samsung Unveils Multiformat Mobile DTV Chip

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Seoul, South Korea — Samsung Electronics has developed a 65 nanometer multistandard channel decoder and multiband RF tuner chipset that will support multidigital mobile TV standards including DVB-H/T, DAB-IP, ISDB-T and terrestrial DMB, for mobile digital TV reception compatibility in different countries.

Samsung expects to launch the first products in Europe and Asia. Samsung’s mobile TV reception system is also among 10 proposals currently vying for ATSC approval in the United States.

The multistandard, multiband mobile TV chipset integrates a range of segment standards. As countries worldwide introduce their mobile TV service standards, the chipset allows end users to choose which broadcasting services they want to use without changing their mobile application.

The multistandard channel decoder transforms the analog signal into digital signal in order to restore the image and audio source. It is fully compliant to DVB-H/T, T-DMB, DAB, DAB-IP and ISDB-T 1 segment standards.

Samsung said its 65nm technology combines the benefits of high performance and cost effectiveness. The high signal reception rate is a core characteristic, which realizes a smooth mobile TV experience even on high-speed trains.

The multiband RF tuner, which receives the analog broadcast signal, has a simplified circuit structure by applying a low IF to compliment the conventional zero IF. It is also a general purpose tuner that supports UHF, VHF and L-band commonly used in Europe and the United States. The wide use of the RF tuner compliments the advanced performance of the multistandard channel decoder.

The new chipset can be offered either as two stand-alone ICs or as a system-in-chip package (SiP), which places together the RF tuner and the channel chip on a single module package, Samsung said.

Samsung cited a Strategic Analytics study that predicts the mobile TV market reaching 12 million units in 2007 and 130 million units by 2011 at a compounded annual growth rate of 67 percent.

Mass production of the chipset is slated for the fourth quarter of 2007.

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