CES 2009: Altec Lansing Debuts Wireless Headphones

By Staff -- TWICE, January 8, 2009

LAS VEGAS — Altec Lansing is debuting wireless headphones at International CES in the Plantronics booth in South 1, 20908.

The BackBeat 906 with a separate Bluetooth adapter features dual microphones that offer Bluetooth, stereo sound and high-quality voice connectivity to most MP3 enabled mobile phones. With a remote A2DP adapter, the new BackBeat 906 doubles as a wireless stereo headphone for any iPhone, iPod or digital MP3 music player.

Other features include: Bluetooth 2.1 and enhanced data rate; support for A2DP, AVRCP, HSP v1.1 and HFPv1.5 profiles for stereo audio; and Plantronics' proprietary QuickPair technology, which is said to automatically locate and establish connection between the headphones and Bluetooth-enabled mobile phone/MP3 device.

The headphones' dual omnidirectional microphones are meant to ensure that voice is clearly picked up during conversations, and the AudioIQ DSP (digital signaling processing) noise-canceling technology allows users to experience exceptional audio clarity on both sides of calls/conversations, according to the company.

Two telescoping ear buds ensure excellent fit as well binaural communication and listening — audio in both ears while on a phone call, it said. And the company's proprietary ListenUp function is meant to enable users to switch to a mode that "opens" the headphone up for instant outside environment audio with a push of a button.

The headphones come with a Bluetooth adapter with 3.5mm connection for non-Bluetooth-enabled MP3 devices.

Battery life is said to be seven hours of listening time and seven hours of talktime. It weighs 33 grams.

The headphones feature a flexible neckband design; sweat-resistant materials and design, including molded fin patterns at the inside surface that are said to displace sweat while keep the headset cool during extended wearing; telescoping and swiveling earpiece; evenly distributed left/right headphone weight; soft rubber material for areas touching the skin, while the hard-shell back cover reportedly shields it from harsh environments; a dynamic form factor that's meant to follow the organic shapes of the ear and hides bulk of the product body discretely behind the ears; and controls intuitively located on each earpiece.